Description

A study by StrategyHelix indicates that the global wireless connectivity market is expected to increase by US$ 76.6 billion from 2022 to 2028, garnering a CAGR of 12.7% during the forecast period.

The report provides up-to-date market size data for period 2018-2021 and forecast to 2028 covering key market aspects like sales value for wireless connectivity. The global wireless connectivity market is segmented on the basis of technology, network type, end user, and region. Based on technology, the global wireless connectivity market is categorized into Bluetooth, cellular M2M, LoRa, NFC, Wi-Fi, Zigbee, others. The Bluetooth segment held the largest share of the global wireless connectivity market in 2021 and is anticipated to hold its share during the forecast period. On the basis of network type, the global wireless connectivity market has been segmented into wireless wide area network (WWAN), wireless personal area network (WPAN), wireless local area network (WLAN). Globally, the WPAN segment made up the largest share of the wireless connectivity market. By end user, the global wireless connectivity market has been segmented into automotive and transportation, building automation, consumer electronics and wearables, energy and utilities, healthcare, industrial, IT and telecom, others. The consumer electronics and wearables segment was the largest contributor to the global wireless connectivity market in 2021. In terms of geography, the global wireless connectivity market has been segmented into Asia Pacific, Europe, North America, Rest of the World (RoW). Asia Pacific is estimated to account for the largest share of the global wireless connectivity market.

The global wireless connectivity market is highly competitive. As of 2021, the major players in the global wireless connectivity market were Broadcom Inc., Infineon Technologies AG, Intel Corporation, MediaTek Inc., Murata Manufacturing Co. Ltd., NXP Semiconductors N.V., Panasonic Corporation, Qualcomm Inc., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments Incorporated (TI). Competitive landscape gives a description of the competitive nature of the global wireless connectivity market and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

The report is an invaluable resource for companies and organizations active in this industry. It provides a cohesive picture of the wireless connectivity market to help drive informed decision making for industry executives, policy makers, academic, and analysts.

Report Scope

Technology: Bluetooth, cellular M2M, LoRa, NFC, Wi-Fi, Zigbee, others
Network type: wireless wide area network (WWAN), wireless personal area network (WPAN), wireless local area network (WLAN)
End user: automotive and transportation, building automation, consumer electronics and wearables, energy and utilities, healthcare, industrial, IT and telecom, others
Region: Asia Pacific, Europe, North America, Rest of the World (RoW)
Years considered: this report covers the period 2018 to 2028
Company mentioned: Broadcom Inc., Infineon Technologies AG, Intel Corporation, MediaTek Inc., Murata Manufacturing Co. Ltd., NXP Semiconductors N.V., Panasonic Corporation, Qualcomm Inc., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments Incorporated (TI)

Key Benefits for Stakeholders

– Get a comprehensive picture of the global wireless connectivity market
– Pinpoint growth sectors and trends for investment

Table of Contents

Part 1. Introduction
– Scope of the study
– Study period
– Geographical scope
– Research methodology
Part 2. Wireless connectivity market overview
Part 3. Market breakdown by technology
– Bluetooth
– Cellular M2M
– LoRa
– NFC
– Wi-Fi
– Zigbee
– Others
Part 4. Market breakdown by network type
– Wireless wide area network (WWAN)
– Wireless personal area network (WPAN)
– Wireless local area network (WLAN)
Part 5. Market breakdown by end user
– Automotive and transportation
– Building automation
– Consumer electronics and wearables
– Energy and utilities
– Healthcare
– Industrial
– IT and telecom
– Others
Part 6. Market breakdown by region
– Asia Pacific
– Europe
– North America
– Rest of the World (RoW)
Part 7. Key companies
– Broadcom Inc.
– Infineon Technologies AG
– Intel Corporation
– MediaTek Inc.
– Murata Manufacturing Co., Ltd.
– NXP Semiconductors N.V.
– Panasonic Corporation
– Qualcomm Inc.
– Renesas Electronics Corporation
– STMicroelectronics N.V.
– Texas Instruments Incorporated (TI)
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