Description

A wireless chipset is a piece of internal hardware designed to allow a device to communicate with another wireless-enabled device. The global wireless chipsets market is poised to grow by US$ 4.7 billion from 2022 to 2028, registering a CAGR of 8.3% during the forecast period, according to StrategyHelix.

The report provides up-to-date market size data for period 2018-2021 and forecast to 2028 covering key market aspects like sales value for wireless chipsets. The global wireless chipsets market is segmented on the basis of product, end user, and region. By product, the global wireless chipsets market has been segmented into Bluetooth standalone, low-power wireless IC, Wi-Fi and Bluetooth combo, Wi-Fi standalone. In 2021, the low-power wireless IC segment made up the largest share of revenue generated by the wireless chipsets market. Based upon end user, the global wireless chipsets market is categorized into automotive, consumer electronics, enterprise, industrial, mobile handsets, others. The mobile handsets segment was the largest contributor to the global wireless chipsets market in 2021. In terms of geography, the global wireless chipsets market has been segmented into Asia Pacific, Europe, North America, Rest of the World (RoW). North America is estimated to account for the largest share of the global wireless chipsets market.

The global wireless chipsets market is highly competitive. The key players in the wireless chipsets market include Broadcom Inc., HiSilicon Technology Co. Ltd., Infineon Technologies AG, Intel Corporation, MediaTek Inc., Microchip Technology Inc., NXP Semiconductors N.V., ON Semiconductor Corporation (onsemi), Qorvo Inc., Qualcomm Incorporated, Realtek Semiconductor Corp., Skyworks Solutions Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Tsinghua Unigroup Co. Ltd. Competitive landscape gives a description of the competitive nature of the global wireless chipsets market and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

The report is an invaluable resource for companies and organizations active in this industry. It provides a cohesive picture of the wireless chipsets market to help drive informed decision making for industry executives, policy makers, academic, and analysts.

Report Scope

Product: Bluetooth standalone, low-power wireless IC, Wi-Fi and Bluetooth combo, Wi-Fi standalone
End user: automotive, consumer electronics, enterprise, industrial, mobile handsets, others
Region: Asia Pacific, Europe, North America, Rest of the World (RoW)
Years considered: this report covers the period 2018 to 2028
Company mentioned: Broadcom Inc., HiSilicon Technology Co. Ltd., Infineon Technologies AG, Intel Corporation, MediaTek Inc., Microchip Technology Inc., NXP Semiconductors N.V., ON Semiconductor Corporation (onsemi), Qorvo Inc., Qualcomm Incorporated, Realtek Semiconductor Corp., Skyworks Solutions Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Tsinghua Unigroup Co. Ltd.

Key Benefits for Stakeholders

– Get a comprehensive picture of the global wireless chipsets market
– Pinpoint growth sectors and trends for investment

Table of Contents

Part 1. Introduction
– Scope of the study
– Study period
– Geographical scope
– Research methodology
Part 2. Wireless chipsets market overview
Part 3. Market breakdown by product
– Bluetooth standalone
– Low-power wireless IC
– Wi-Fi and Bluetooth combo
– Wi-Fi standalone
Part 4. Market breakdown by end user
– Automotive
– Consumer electronics
– Enterprise
– Industrial
– Mobile handsets
– Others
Part 5. Market breakdown by region
– Asia Pacific
– Europe
– North America
– Rest of the World (RoW)
Part 6. Key companies
– Broadcom Inc.
– HiSilicon Technology Co., Ltd.
– Infineon Technologies AG
– Intel Corporation
– MediaTek Inc.
– Microchip Technology Inc.
– NXP Semiconductors N.V.
– ON Semiconductor Corporation (onsemi)
– Qorvo, Inc.
– Qualcomm Incorporated
– Realtek Semiconductor Corp.
– Skyworks Solutions, Inc.
– STMicroelectronics N.V.
– Texas Instruments Incorporated
– Tsinghua Unigroup Co., Ltd.
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