Global Semiconductor Packaging and Testing Market

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The global semiconductor packaging and testing market was around 56 billion USD in 2019, reached 59 billion USD in 2020 (an increase of 5.4% year-on-year), according to StrategyHelix’ analysis.

This 2nd edition of Global Semiconductor Packaging and Testing Market includes following information:
Market Overview: Market Size, Grow Rate, CAGR
Competitors: ASE Technology Holding Co., Ltd., Amkor Technology, Inc., JCET Group Co., Ltd., VX Technologies, Inc., TongFu Microelectronics Co., Ltd., Tianshui Huatian Technology Co., Ltd., King Yuan Electronics Co., Ltd., ChipMOS Technologies, Inc., Others
Years Considered: this database covers the period 2016-2020

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StrategyHelix DataPass produces a series of directories and databases on industries, economies and consumers in Western and Central Europe, North and South America, Asia Pacific, the Middle East and Africa. DataPass aims at helping our clients analyze market context and identify future trends.

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Release Date

30 March 2022






Global Semiconductor Packaging and Testing Market

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