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Market Overview

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The global market for radiation-hardened electronics for space applications is projected to reach $4,761 million by 2032, growing at a rate of 1.70% during the forecast period. This growth is primarily driven by the increasing demand for communication and Earth observation satellites.

Semiconductors are essential components of electronic circuits, possessing unique electrical properties between insulators and conductors. These components are crucial for a wide range of applications, from simple timers to complex instruments like satellites and supercomputers. Radiation-hardened electronics are electronic components designed to withstand high levels of radiation commonly found in industries such as defense, energy, and aerospace. Technological advancements in electronic components and semiconductors have allowed satellite and launch vehicle manufacturers to operate in high-radiation environments. However, the high-altitude space environment poses challenges in building semiconductor devices capable of withstanding radiation effects. Issues such as noise and signal spikes caused by single charged particle strikes can lead to inaccuracies and performance problems in electronic devices used in satellites, deep-space probes, and launch vehicles.

In recent years, there has been a significant shift towards adopting small satellites, particularly in satellite constellations for applications like Earth observation, remote sensing, and space-based broadband services. This trend has fueled the demand for radiation-hardened electronic components. Several ongoing projects aim to develop advanced, cost-effective radiation-hardened electronics to support upcoming mega-constellations and meet the growing interest in long-lasting satellite components capable of withstanding harsh space environments.

Various radiation-hardened electronics currently used in space applications include onboard computers, microprocessors and microcontrollers, power sources, solid-state recorders, field-programmable gate arrays, transmitters and receivers (antennas), application-specific integrated circuits, and sensors. The market for radiation-hardened electronics for space applications is well-established, as these components are required across all platforms in space.

The increasing number of satellites in low Earth orbit (LEO) and the upcoming mega-constellations have created a demand for space-based radiation-hardened components capable of withstanding high radiation effects from solar flares. Additionally, the interest in long-term missions by space agencies necessitates radiation-hardened components that can survive severe environments while being compressed or miniaturized to support complex missions for extended periods.

Drivers of the radiation-hardened electronics for space applications market include the rising demand for radiation-hardened electronic components in communication satellites and technological advancements in microprocessors and field-programmable gate arrays (FPGAs). However, challenges such as high development and design costs associated with radiation-hardened electronic components and the impact of electronics component shortages on the global space industry need to be addressed.

Opportunities in the radiation-hardened electronics for space applications market include the adoption of new materials for manufacturing space electronics. Exploring innovative materials can lead to improved radiation resistance and performance of space-based electronic components.

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Market Segmentation

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The market is segmented based on various factors, including platform, manufacturing technique, material type, component, and region.

Segmentation by Platform
Satellite
Launch Vehicle
Deep Space Probe

Segmentation by Manufacturing Technique
Rad-Hard by Design
Rad-Hard by Process
Rad-Hard by Software

Segmentation by Material Type
Silicon
Gallium Nitride
Silicon Carbide
Others

Segmentation by Component
Onboard Computer, Microprocessor, and Controller
Power Source
Memory (Solid-State Recorder)
Field-Programmable Gate Array
Transmitter and Receiver (Antennas)
Application-Specific Integrated Circuit
Sensor

Segmentation by Region
North America – U.S., and Canada
Europe – France, Germany, Russia, U.K, and Rest-of-Europe
Asia-Pacific – China, Japan, India, and Rest-of-Asia-Pacific
Rest-of-the-World – Middle East and Africa, and South America

In terms of platforms, the satellite platform is expected to dominate the global market for radiation-hardened electronics for space applications. Revenue generation from the satellite platform segment is projected to contribute significantly to the overall market, followed by the launch vehicle and deep space probe segments. In 2021, the satellite segment reported revenue of $1,681 million, and it is anticipated to grow at a CAGR of 0.97% during the forecast period of 2022-2032, reaching $3,499 billion by 2032. This growth can be attributed to the increasing deployment of small satellites and small launch vehicles, as well as the plans for deep space missions by key players such as SpaceX, OneWeb, Telesat, Space Development Agency, NASA, ISRO, ESA, and JAXA.

Regarding manufacturing techniques, the rad-hard by design segment slightly dominates the global radiation-hardened electronics market. Although this manufacturing technique is expensive, the components provide robust solutions with the highest radiation hardness rating, making them suitable for extreme space applications like deep space missions and satellites. The rad-hard by design segment is expected to hold a market share of 61.05% in 2032, with a market value of $2,907 million. In 2021, it generated $1,458 million in revenue and is projected to grow at a CAGR of 1.54% during the forecast period. The rad-hard by process segment is also expected to gain prominence, growing at a CAGR of 1.77% during the same period.

Silicon is the most widely used material for radiation-hardened components due to its ability to reduce size and weight while improving computation performance, especially in medium to high-speed applications. In 2021, the silicon segment had the highest market penetration, followed by gallium nitride. The silicon segment generated $1,858 million in revenue and is predicted to grow at a CAGR of 1.47% from 2022 to 2032, reaching $3,676 million by 2032.

Advancements in technology are driving the use of onboard computers, microprocessors, and controllers for new applications that require efficient and robust microprocessor technology. This trend is leading to the deployment of highly sophisticated applications in smaller spaces. In 2021, the onboard computer, microprocessor, and controller segment had the highest market penetration, generating $621 million in revenue. It is expected to grow at a CAGR of 1.16% during the forecast period, reaching $1,232 million by 2032.

North America held the highest market share (41.25%) in the global radiation-hardened electronics market for satellite platforms in 2021, primarily due to the presence of numerous companies in the region. Europe accounted for a share of 25.79% in 2021 and is projected to witness significant growth during the forecast period, driven by space activities in the U.K., France, Germany, and Russia. Increased investments by commercial space organizations like Analog Device, BAE System, and Cobham Plc, as well as government key agencies, are expected to drive substantial growth in the market for radiation-hardened electronics for satellite platforms.

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Competitive Landscape

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The selection of the profiled companies was based on inputs gathered from primary experts and an analysis of factors such as the company’s market coverage, product portfolio, and market penetration.

The market is primarily led by established players that offer radiation-hardened electronics for space applications. These top segment players hold approximately 80% of the market share. Additionally, there are start-up entities that make up around 20% of the market presence.

Key companies profiled in this report include 3D Plus, Analog Devices, Inc., Apogee Semiconductor, Cobham Plc, Data Device Corporation, Exxelia, General Dynamics, GSI Technology, Inc., Infineon Technologies, Mercury Systems, Inc., Microchip Technology, Inc., Micropac Industries, Renesas Electronics Corporation, Solid State Devices, Inc., STMicroelectronics N.V., Teledyne Technologies, Texas Instruments, Vorago Technologies, Xilinx, Inc.

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Recent Industry Developments

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In June 2020, GSI Technology entered into a partnership with the NSF Center for Space to develop cost-effective radiation-hardened and modular computer systems for various space-related endeavors, ranging from ground-based high-performance computing data centers to deep space missions.

In March 2021, Mercury Systems secured a contract with NASA’s Jet Propulsion Laboratory to supply solid-state data recorders for a scientific mission. These devices will be integrated into an Earth-imaging spectrometer instrument, which is scheduled for launch in 2022.

In August 2021, STMicroelectronics collaborated with Xilinx, Inc. to design a power solution for Xilinx’s radiation-tolerant field-programmable gate arrays (FPGA) using QML-V qualified voltage regulators.

In April 2021, Exxelia introduced a high-performance space-qualified resistor that fulfills the requirements of weapons platforms, modern electronic warfare systems, and a wide range of space applications.

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Key Questions Answered

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What are the future trends in the radiation-hardened electronics for space applications market, and how is the market projected to evolve between 2022 and 2032?

What are the main drivers and challenges faced by companies operating in the radiation-hardened electronics for space applications market?

How is the market expected to grow during the forecast period from 2022 to 2032?

What opportunities exist for companies to expand their presence in the radiation-hardened electronics for space applications market?

Which region is anticipated to dominate the radiation-hardened electronics for space applications market by 2032?

What are the key strategies implemented by the leading players to sustain their position in this highly competitive market?

What is the current and future revenue outlook for the radiation-hardened electronics for space applications market?