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Market Overview

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Panel-level packaging has emerged as a crucial step in the progression of Fan-out wafer-level packaging. Rather than pursuing a roadmap to 450 mm Fan-out Wafer Level Packaging, global vendors are now prioritizing the upscaling of Panel Level Packaging (PLP). This shift is driven by the potential cost advantages that PLP offers through the parallelization of process steps and increased area utilization of rectangular panel formats, which minimizes material waste compared to round wafer shapes.

The Panel Level Packaging Market, estimated at USD 418 million in 2021 (in nominal/real terms), is projected to reach USD 3,203 million by 2027, exhibiting a compound Annual Growth Rate (CAGR) of 41.91%. This growth is attributed to the semiconductor industry’s rapid expansion, with semiconductors serving as the foundational components of modern technology. Advancements in this sector directly impact downstream technologies, necessitating the development of the Panel Level Packaging market.

The demand for 400 mm wafers is driving the increasing focus on panel-level packaging. Recognized as an integral step in Fan-out wafer-level packaging, the global industry is concentrating efforts on scaling up the adoption of PLP instead of pursuing the transition to 450 mm Fan-out Wafer Level Packaging. Furthermore, PLP promises significant cost benefits by leveraging parallel processes and maximizing package area utilization through rectangular panel formats, as opposed to round wafer shapes, thereby reducing material waste.

The COVID-19 pandemic has slowed investment and focus on panel-level packaging, as many semiconductor manufacturers prioritize securing a stable supply of 300 mm wafers. Cost remains a key factor driving the adoption of larger diameter wafers in the rapidly expanding market. Additionally, the focus on 300 mm wafers aims to address shortages experienced by certain end-user industries. The demand for 200 mm Sic wafers is expected to exceed supply throughout the forecast period.

Nevertheless, the importance of Panel Level Packaging is increasing due to its cost benefits and the ability to accommodate larger package sizes in panel formats. Moreover, the parallel manufacturing of a greater number of packages becomes possible. Additionally, PLP can leverage processes, materials, and equipment from other technology areas such as Printed Circuit Board (PCB), Liquid Crystal Display (LCD), or solar equipment, which are also manufactured on panel sizes. This offers new approaches for Fan-out Panel Level Packaging as well.

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Market Segmentation

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The market is segmented based on various factors, including application and region.

Segmentation by Application
Consumer Electronics
Automotive
Telecommunication
Other Industry Application

Segmentation by Region
United States
China
Korea
Taiwan
Japan
Europe
Rest of the World

In 2021, Consumer Electronics accounted for the largest market share of 46.68% in terms of application segment. The segment was valued at USD 195 million and is projected to reach USD 1,412 million by 2027.

Consumer electronics is a major end-user industry driving the growth of the market. The increasing adoption of smart devices, wearables, and consumer IoT devices in applications like smart homes, along with the growth in the smartphone industry, are significant drivers for this segment. The trend of miniaturization in the consumer electronics industry has resulted in smaller, lighter, and more portable devices. Each new generation of consumer electronics products is more innovative, lightweight, and energy-efficient than its predecessors. This creates high customer expectations for future iterations, which serves as a key selling point for consumer electronics producers. Advanced semiconductor packaging technologies play a crucial role in meeting the complex and evolving needs of the consumer electronics market.

Panel-level packaging, particularly in footprint-sensitive devices like smartphones, has witnessed increasing applications due to the demand for high-performing, energy-efficient, thin, and small form factor packages. The growing penetration of these devices in recent years has significantly contributed to the market’s demand. For instance, smartphone subscriptions reached 6.3 billion at the end of 2021, accounting for about 77% of all mobile phone subscriptions. This number is projected to increase to 7.8 billion by 2027, representing approximately 87% of all mobile subscriptions.

Furthermore, Samsung’s collaboration with Google to develop the second-generation Tensor SoC, anticipated to be used in Google’s upcoming Pixel 7 and 7 Pro smartphones, highlights the adoption of panel-level packaging technology. Panel-level packaging (PLP) is increasingly popular, especially fan-out panel level packaging (FOPLP), due to its advantages including low cost-potential. Mainstream chips utilizing this technology include Antenna-in-Package (AiP) antenna modules in 5G smartphones, integrated chips in wearable devices, and Internet of Things (IoT) applications.

Taiwan captured the largest market share of 39.85% in 2021, valued at USD 166.68 million. Its strong ICT industry base, robust semiconductor manufacturing clusters, and advanced manufacturing capacity have established Taiwan as a renowned electronics manufacturing hub. Numerous companies in the region offer advanced ICT-related products, particularly in electronic components, computers, fiber optic cable, and telecommunications equipment sectors. Taiwan is a leading global manufacturer of computers, which contributes significantly to the demand for semiconductor chips. In 2021, the production value of portable computers in Taiwan exceeded NTD 57 billion. Successful COVID-19 strategies, rising tensions between mainland China and the United States, and government initiatives have propelled the region’s computer manufacturing sector to its highest output since 2004. The Action Plan for Welcoming Overseas Taiwanese Businesses to Return to Invest in Taiwan, launched in 2019, has also played a role in these positive developments, according to the Ministry of Economic Affairs.

China represents the fastest-growing region in the panel-level packaging market. As the largest consumer of semiconductors and the world’s leading producer and exporter of consumer electronics, China’s domestic electronics market size is a significant driving force. The electronics manufacturing industry in China has consistently expanded, with major electronics manufacturers experiencing a 12.7% year-on-year growth in added value during the first two months of 2022, compared to the 7.5% overall industrial sector growth. The Chinese government has implemented various initiatives to boost the electronics industry’s growth, including plans to expand the domestic market for electronic components to CNY 2.1 trillion (USD 327 billion) by 2023. This plan encompasses components, materials, and manufacturing equipment used in various sectors such as smartphones, drones, 5G wireless, connected factories, electric vehicles, robotics, high-speed rail, and aerospace. The government aims to increase the output of semiconductors, sensors, magnets, fiber-optic equipment, software, and other components through these initiatives, further driving market growth.

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Competitive Landscape

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Key Companies Profiled in this report include Samsung Electronics, Intel Corporation, Nepes Corporation, ASE Group, PowerTech Technology Inc., Fraunhofer Institute for Reliability and Micro integration IZM, Unimicron Technology Corporation, DECA Technologies Inc., JCET/ STATSChipPAC.

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Recent Industry Developments

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In December 2021, Nepes Laweh Corporation announced the successful completion of the Cheongan Campus, a state-of-the-art facility situated on a 46-acre (186,000 m2) plot of land, equivalent to the size of 25 soccer fields. This campus serves as a cutting-edge PLP (Panel Level Packaging) fabrication plant with an annual production capacity of up to 96,000 600mm PLP panels. With a focus on meeting the demanding requirements of advanced system semiconductors for various applications including smartphones, vehicles, and IoT, Nepes aims to provide high-density packaging solutions.

In May 2022, an article published on the Korean news site Digital Daily suggested that Samsung is once again positioned to supply Google’s in-house chip initiatives. It is reported that Samsung will manufacture the updated Cloudripper GS201 Tensor chipset, which is expected to be incorporated into the Pixel 7 series of smartphones.

As part of its ongoing efforts to enhance its capabilities, Samsung has made significant investments. In 2019, the company acquired the panel level package (PLP) business, a next-generation packaging technology, from Samsung Electro-Mechanics for a staggering 785 billion KRW. This strategic move further reinforces Samsung’s commitment to advancing its presence in the semiconductor industry.

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Key Questions Answered

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What is the growth rate of the Panel Level Packaging Market?
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Which region exhibits the highest growth rate in the Panel Level Packaging Market?
Which region holds the largest share in the Panel Level Packaging Market?
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