Description

According to StrategyHelix, the global IO link system market is expected to increase by US$ 19.5 billion during 2022-2028, expanding at a CAGR of 23.4% during the forecast period.

The report provides up-to-date market size data for period 2018-2021 and forecast to 2028 covering key market aspects like sales value for IO link system. The global IO link system market is segmented on the basis of component, application, industry, and region. Based on component, the global IO link system market is categorized into IO-Link devices, IO-Link masters. The IO-Link devices segment captured the largest share of the market in 2021. On the basis of application, the global IO link system market has been segmented into handling and assembly automation, intralogistics, machine tools, packaging. The handling and assembly automation segment held the largest share of the global IO link system market in 2021 and is anticipated to hold its share during the forecast period. By industry, the global IO link system market has been segmented into discrete manufacturing, process manufacturing. In 2021, the discrete manufacturing segment made up the largest share of revenue generated by the IO link system market. Geographically, the global IO link system market is segmented into Asia Pacific, Europe, North America, Rest of the World (RoW). Among these, Europe was accounted for the highest revenue generator in 2021.

The global IO link system market is highly competitive. The prominent players operating in the global IO link system market include Balluff GmbH, Banner Engineering Corp., Datalogic S.p.A., Festo Corporation, Hans Turck GmbH & Co. KG, ifm electronic GmbH, Omron Corp., Pepperl+Fuchs SE, Rockwell Automation Inc., Sick AG, Siemens AG. Competitive landscape gives a description of the competitive nature of the global IO link system market and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

The report is an invaluable resource for companies and organizations active in this industry. It provides a cohesive picture of the IO link system market to help drive informed decision making for industry executives, policy makers, academic, and analysts.

Report Scope

Component: IO-Link devices, IO-Link masters
Application: handling and assembly automation, intralogistics, machine tools, packaging
Industry: discrete manufacturing, process manufacturing
Region: Asia Pacific, Europe, North America, Rest of the World (RoW)
Years considered: this report covers the period 2018 to 2028
Company mentioned: Balluff GmbH, Banner Engineering Corp., Datalogic S.p.A., Festo Corporation, Hans Turck GmbH & Co. KG, ifm electronic GmbH, Omron Corp., Pepperl+Fuchs SE, Rockwell Automation Inc., Sick AG, Siemens AG

Key Benefits for Stakeholders

– Get a comprehensive picture of the global IO link system market
– Pinpoint growth sectors and trends for investment

Table of Contents

Part 1. Introduction
– Scope of the study
– Study period
– Geographical scope
– Research methodology
Part 2. IO link system market overview
Part 3. Market breakdown by component
– IO-Link devices
– IO-Link masters
Part 4. Market breakdown by application
– Handling and assembly automation
– Intralogistics
– Machine tools
– Packaging
Part 5. Market breakdown by industry
– Discrete manufacturing
– Process manufacturing
Part 6. Market breakdown by region
– Asia Pacific
– Europe
– North America
– Rest of the World (RoW)
Part 7. Key companies
– Balluff GmbH
– Banner Engineering Corp.
– Datalogic S.p.A.
– Festo Corporation
– Hans Turck GmbH & Co. KG
– ifm electronic GmbH
– Omron Corp.
– Pepperl+Fuchs SE
– Rockwell Automation, Inc.
– Sick AG
– Siemens AG
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