Description

A study by StrategyHelix indicates that the global fan out packaging market is expected to increase by US$ 2.7 billion from 2022 to 2028, garnering a CAGR of 17.2% during the forecast period.

The report provides up-to-date market size data for period 2018-2021 and forecast to 2028 covering key market aspects like sales value for fan out packaging. The global fan out packaging market is segmented on the basis of type, carrier type, business model, and region. Based on type, the global fan out packaging market is categorized into core-fan out, high-density fan out, ultra high-density fan out. Globally, the high-density fan out segment made up the largest share of the fan out packaging market. On the basis of carrier type, the global fan out packaging market has been segmented into 200 mm, 300 mm, Panel. The 300 mm segment captured the largest share of the market in 2021. By business model, the global fan out packaging market has been segmented into foundry, integrated device manufacturer (IDM), outsourced semiconductor assembly and test (OSAT). According to the research, the foundry segment had the largest share in the global fan out packaging market. In terms of geography, the global fan out packaging market has been segmented into China, Europe, Japan, South Korea, Taiwan, United States. Taiwan held the largest revenue share in 2021.

The global fan out packaging market is highly competitive. The competitive landscape of the industry has also been examined along with the profiles of the key players Amkor Technology Inc., ASE Inc., JCET Group, Nepes Corporation, Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company Limited. Competitive landscape gives a description of the competitive nature of the global fan out packaging market and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

The report is an invaluable resource for companies and organizations active in this industry. It provides a cohesive picture of the fan out packaging market to help drive informed decision making for industry executives, policy makers, academic, and analysts.

Report Scope

Type: core-fan out, high-density fan out, ultra high-density fan out
Carrier type: 200 mm, 300 mm, Panel
Business model: foundry, integrated device manufacturer (IDM), outsourced semiconductor assembly and test (OSAT)
Region: China, Europe, Japan, South Korea, Taiwan, United States
Years considered: this report covers the period 2018 to 2028
Company mentioned: Amkor Technology Inc., ASE Inc., JCET Group, Nepes Corporation, Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company Limited

Key Benefits for Stakeholders

– Get a comprehensive picture of the global fan out packaging market
– Pinpoint growth sectors and trends for investment

Table of Contents

Part 1. Introduction
– Scope of the study
– Study period
– Geographical scope
– Research methodology
Part 2. Fan out packaging market overview
Part 3. Market breakdown by type
– Core-fan out
– High-density fan out
– Ultra high-density fan out
Part 4. Market breakdown by carrier type
– 200 mm
– 300 mm
– Panel
Part 5. Market breakdown by business model
– Foundry
– Integrated device manufacturer (IDM)
– Outsourced semiconductor assembly and test (OSAT)
Part 6. Market breakdown by region
– China
– Europe
– Japan
– South Korea
– Taiwan
– United States
Part 7. Key companies
– Amkor Technology Inc.
– ASE, Inc.
– JCET Group
– Nepes Corporation
– Powertech Technology Inc.
– Samsung Electronics Co., Ltd.
– Taiwan Semiconductor Manufacturing Company Limited
About StrategyHelix
Disclaimer