Description

The global cots components for satellites market is poised to grow by US$ 302.2 million during 2022-2028, progressing at a CAGR of 1.4% during the forecast period, according to data and analytics company StrategyHelix.

The report provides up-to-date market size data for period 2018-2021 and forecast to 2028 covering key market aspects like sales value for cots components for satellites. The global cots components for satellites market is segmented on the basis of subsystem, mass class, and region. By subsystem, the global cots components for satellites market has been segmented into attitude determination and control subsystem, command and data handling system, communication subsystem, electrical and power subsystem, payload, propulsion control subsystem, thermal control subsystem, others. In 2021, the attitude determination and control subsystem segment made up the largest share of revenue generated by the cots components for satellites market. Based upon mass class, the global cots components for satellites market is categorized into 0-500kg, 501-1,000kg, 1,001kg and above. Geographically, the global cots components for satellites market is segmented into Asia Pacific, Europe, North America, Rest of the World (RoW).

The global cots components for satellites market is highly competitive. The leading players in the cots components for satellites market include Amplified Design LLC, Analog Devices Inc., BAE Systems plc, Cobham Limited, Curtiss-Wright Corporation, Data Device Corporation (DDC), Exxelia SAS, GSI Technology Inc., Honeywell International Inc., Infineon Technologies AG, Microchip Technology Inc., Micropac Industries Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Xilinx Inc. Competitive landscape gives a description of the competitive nature of the global cots components for satellites market and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

The report is an invaluable resource for companies and organizations active in this industry. It provides a cohesive picture of the cots components for satellites market to help drive informed decision making for industry executives, policy makers, academic, and analysts.

Report Scope

Subsystem: attitude determination and control subsystem, command and data handling system, communication subsystem, electrical and power subsystem, payload, propulsion control subsystem, thermal control subsystem, others
Mass class: 0-500kg, 501-1,000kg, 1,001kg and above
Region: Asia Pacific, Europe, North America, Rest of the World (RoW)
Years considered: this report covers the period 2018 to 2028
Company mentioned: Amplified Design LLC, Analog Devices Inc., BAE Systems plc, Cobham Limited, Curtiss-Wright Corporation, Data Device Corporation (DDC), Exxelia SAS, GSI Technology Inc., Honeywell International Inc., Infineon Technologies AG, Microchip Technology Inc., Micropac Industries Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Xilinx Inc.

Key Benefits for Stakeholders

– Get a comprehensive picture of the global cots components for satellites market
– Pinpoint growth sectors and trends for investment

Table of Contents

Part 1. Introduction
– Scope of the study
– Study period
– Geographical scope
– Research methodology
Part 2. Cots components for satellites market overview
Part 3. Market breakdown by subsystem
– Attitude determination and control subsystem
– Command and data handling system
– Communication subsystem
– Electrical and power subsystem
– Payload
– Propulsion control subsystem
– Thermal control subsystem
– Others
Part 4. Market breakdown by mass class
– 0-500kg
– 501-1,000kg
– 1,001kg and above
Part 5. Market breakdown by region
– Asia Pacific
– Europe
– North America
– Rest of the World (RoW)
Part 6. Key companies
– Amplified Design, LLC
– Analog Devices, Inc.
– BAE Systems plc
– Cobham Limited
– Curtiss-Wright Corporation
– Data Device Corporation (DDC)
– Exxelia SAS
– GSI Technology, Inc.
– Honeywell International Inc.
– Infineon Technologies AG
– Microchip Technology, Inc.
– Micropac Industries, Inc.
– STMicroelectronics N.V.
– Texas Instruments Incorporated
– Xilinx, Inc.
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