Description

The global 2.5d and 3d semiconductor packaging market is set to increase by US$ 8.5 billion from 2022 to 2028, representing a compound annual growth rate (CAGR) of 13.6% during the forecast period.

The report provides up-to-date market size data for period 2018-2021 and forecast to 2028 covering key market aspects like sales value for 2.5d and 3d semiconductor packaging. The global 2.5d and 3d semiconductor packaging market is segmented on the basis of technology, end user, and region. On the basis of technology, the global 2.5d and 3d semiconductor packaging market has been segmented into 2.5D, 3D. Among these, the 3D segment was accounted for the highest revenue generator in 2021. By end user, the global 2.5d and 3d semiconductor packaging market has been segmented into automotive, consumer electronics, medical devices, telecommunications, others. In terms of geography, the global 2.5d and 3d semiconductor packaging market has been segmented into China, Japan, South Korea, Taiwan, United States, Rest of the World (RoW). Taiwan held the largest share of the global 2.5d and 3d semiconductor packaging market in 2021 and is anticipated to hold its share during the forecast period.

The global 2.5d and 3d semiconductor packaging market is highly competitive. As of 2021, the major players in the global 2.5d and 3d semiconductor packaging market were Advanced Semiconductor Engineering Inc., Amkor Technology Inc., GlobalFoundries Inc., Intel Corporation, JCET Group Co. Ltd., Powertech Technology Inc., Samsung Electronics Co. Ltd., Siliconware Precision Industries Co. Ltd. (SPIL), Taiwan Semiconductor Manufacturing Company Limited (TSMC), Tezzaron Semiconductor Corp. Competitive landscape gives a description of the competitive nature of the global 2.5d and 3d semiconductor packaging market and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

The report is an invaluable resource for companies and organizations active in this industry. It provides a cohesive picture of the 2.5d and 3d semiconductor packaging market to help drive informed decision making for industry executives, policy makers, academic, and analysts.

Report Scope

Technology: 2.5D, 3D
End user: automotive, consumer electronics, medical devices, telecommunications, others
Region: China, Japan, South Korea, Taiwan, United States, Rest of the World (RoW)
Years considered: this report covers the period 2018 to 2028
Company mentioned: Advanced Semiconductor Engineering Inc., Amkor Technology Inc., GlobalFoundries Inc., Intel Corporation, JCET Group Co. Ltd., Powertech Technology Inc., Samsung Electronics Co. Ltd., Siliconware Precision Industries Co. Ltd. (SPIL), Taiwan Semiconductor Manufacturing Company Limited (TSMC), Tezzaron Semiconductor Corp.

Key Benefits for Stakeholders

– Get a comprehensive picture of the global 2.5d and 3d semiconductor packaging market
– Pinpoint growth sectors and trends for investment

Table of Contents

Part 1. Introduction
– Scope of the study
– Study period
– Geographical scope
– Research methodology
Part 2. 2.5d and 3d semiconductor packaging market overview
Part 3. Market breakdown by technology
– 2.5D
– 3D
Part 4. Market breakdown by end user
– Automotive
– Consumer electronics
– Medical devices
– Telecommunications
– Others
Part 5. Market breakdown by region
– China
– Japan
– South Korea
– Taiwan
– United States
– Rest of the World (RoW)
Part 6. Key companies
– Advanced Semiconductor Engineering, Inc.
– Amkor Technology, Inc.
– GlobalFoundries Inc.
– Intel Corporation
– JCET Group Co., Ltd.
– Powertech Technology Inc.
– Samsung Electronics Co., Ltd.
– Siliconware Precision Industries Co., Ltd. (SPIL)
– Taiwan Semiconductor Manufacturing Company Limited (TSMC)
– Tezzaron Semiconductor Corp.
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