Descrição

The global cots components for satellites market is poised to grow by US$ 302.2 milhões durante 2022-2028, progredindo em um CAGR de 1.4% durante o período de previsão, de acordo com a empresa de dados e análise StrategyHelix.

O relatório fornece dados atualizados sobre o tamanho do mercado para o período 2018-2021 e previsão para 2028 covering key market aspects like sales value for cots components for satellites. The global cots components for satellites market is segmented on the basis of subsystem, mass class, and region. By subsystem, the global cots components for satellites market has been segmented into attitude determination and control subsystem, command and data handling system, communication subsystem, electrical and power subsystem, payload, propulsion control subsystem, thermal control subsystem, outros. Em 2021, the attitude determination and control subsystem segment made up the largest share of revenue generated by the cots components for satellites market. Based upon mass class, the global cots components for satellites market is categorized into 0-500kg, 501-1,000kg, 1,001kg and above. Geographically, the global cots components for satellites market is segmented into Asia Pacific, Europa, América do Norte, Rest of the World (RoW).

The global cots components for satellites market is highly competitive. The leading players in the cots components for satellites market include Amplified Design LLC, Analog Devices Inc., BAE Systems plc, Cobham Limited, Curtiss-Wright Corporation, Data Device Corporation (DDC), Exxelia SAS, GSI Technology Inc., Honeywell International Inc., Infineon Technologies AG, Microchip Technology Inc., Micropac Industries Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Xilinx Inc. Competitive landscape gives a description of the competitive nature of the global cots components for satellites market and a description of the leading companies. Os principais negócios financeiros que moldaram o mercado nos últimos anos são identificados.

O relatório é um recurso inestimável para empresas e organizações ativas neste setor. It provides a cohesive picture of the cots components for satellites market to help drive informed decision making for industry executives, decisores políticos, acadêmico, e analistas.

Escopo do relatório

Subsystem: attitude determination and control subsystem, command and data handling system, communication subsystem, electrical and power subsystem, payload, propulsion control subsystem, thermal control subsystem, outros
Mass class: 0-500kg, 501-1,000kg, 1,001kg and above
Região: Ásia-Pacífico, Europa, América do Norte, Rest of the World (RoW)
Anos considerados: este relatório cobre o período 2018 para 2028
Empresa mencionada: Amplified Design LLC, Analog Devices Inc., BAE Systems plc, Cobham Limited, Curtiss-Wright Corporation, Data Device Corporation (DDC), Exxelia SAS, GSI Technology Inc., Honeywell International Inc., Infineon Technologies AG, Microchip Technology Inc., Micropac Industries Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Xilinx Inc.

Principais benefícios para as partes interessadas

– Get a comprehensive picture of the global cots components for satellites market
– Identifique setores de crescimento e tendências para investimento

Índice

Papel 1. Introdução
– Escopo do estudo
– Período de estudos
– Escopo geográfico
– Metodologia de Pesquisa
Papel 2. Cots components for satellites market overview
Papel 3. Market breakdown by subsystem
– Attitude determination and control subsystem
– Command and data handling system
– Communication subsystem
– Electrical and power subsystem
– Payload
– Propulsion control subsystem
– Thermal control subsystem
– Outros
Papel 4. Market breakdown by mass class
– 0-500kg
– 501-1,000kg
– 1,001kg and above
Papel 5. Market breakdown by region
– Ásia-Pacífico
– Europa
– América do Norte
– Rest of the World (RoW)
Papel 6. Principais empresas
– Amplified Design, LLC
– Analog Devices, Inc..
– BAE Systems plc
– Cobham Limited
– Curtiss-Wright Corporation
– Data Device Corporation (DDC)
– Exxelia SAS
– GSI Technology, Inc..
– Honeywell International Inc.
– Infineon Technologies AG
– Microchip Technology, Inc..
– Micropac Industries, Inc..
– STMicroelectronics N.V.
– Texas Instruments Incorporated
– Xilinx, Inc..
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