설명

A study by StrategyHelix indicates that the global fan out packaging market is expected to increase by US$ 2.7 에서 십억 2022 에게 2028, 의 CAGR 획득 17.2% 예측 기간 동안.

이 보고서는 기간 동안 최신 시장 규모 데이터를 제공합니다. 2018-2021 그리고 예측 2028 covering key market aspects like sales value for fan out packaging. The global fan out packaging market is segmented on the basis of type, carrier type, 비즈니스 모델, 및 지역. 유형에 따라, the global fan out packaging market is categorized into core-fan out, high-density fan out, ultra high-density fan out. 전 세계적으로, the high-density fan out segment made up the largest share of the fan out packaging market. On the basis of carrier type, the global fan out packaging market has been segmented into 200 mm, 300 mm, Panel. 그만큼 300 mm segment captured the largest share of the market in 2021. By business model, the global fan out packaging market has been segmented into foundry, integrated device manufacturer (IDM), outsourced semiconductor assembly and test (OSAT). 연구에 따르면, the foundry segment had the largest share in the global fan out packaging market. 지리학적 측면에서, the global fan out packaging market has been segmented into China, 유럽, 일본, 대한민국, 대만, 미국. Taiwan held the largest revenue share in 2021.

The global fan out packaging market is highly competitive. The competitive landscape of the industry has also been examined along with the profiles of the key players Amkor Technology Inc., ASE Inc., JCET Group, 네패스 주식회사, Powertech Technology Inc., Samsung Electronics Co. (주), Taiwan Semiconductor Manufacturing Company Limited. Competitive landscape gives a description of the competitive nature of the global fan out packaging market and a description of the leading companies. 최근 몇 년 동안 시장을 형성한 주요 금융 거래가 식별됩니다..

이 보고서는 이 업계에서 활동하는 회사 및 조직에 매우 귀중한 리소스입니다.. It provides a cohesive picture of the fan out packaging market to help drive informed decision making for industry executives, 정책 입안자, 학생, 및 분석가.

보고 범위

유형: core-fan out, high-density fan out, ultra high-density fan out
Carrier type: 200 mm, 300 mm, Panel
Business model: foundry, integrated device manufacturer (IDM), outsourced semiconductor assembly and test (OSAT)
지역: 중국, 유럽, 일본, 대한민국, 대만, 미국
년 고려: 이 보고서는 기간을 다룹니다 2018 에게 2028
언급된 회사: Amkor Technology Inc., ASE Inc., JCET Group, 네패스 주식회사, Powertech Technology Inc., Samsung Electronics Co. (주), Taiwan Semiconductor Manufacturing Company Limited

이해관계자를 위한 주요 이점

– Get a comprehensive picture of the global fan out packaging market
– 성장 분야 및 투자 동향 파악

목차

부분 1. 소개
– 연구 범위
– 공부 기간
– 지리적 범위
– 연구 방법론
부분 2. Fan out packaging market overview
부분 3. Market breakdown by type
– Core-fan out
– High-density fan out
– Ultra high-density fan out
부분 4. Market breakdown by carrier type
– 200 mm
– 300 mm
– Panel
부분 5. Market breakdown by business model
– Foundry
– Integrated device manufacturer (IDM)
– Outsourced semiconductor assembly and test (OSAT)
부분 6. 지역별 시장 분석
– 중국
– 유럽
– 일본
– 대한민국
– 대만
– 미국
부분 7. 주요 기업
– Amkor Technology Inc.
– ASE, 주식회사.
– JCET Group
– 네패스 주식회사
– Powertech Technology Inc.
– 삼성전자, (주).
– Taiwan Semiconductor Manufacturing Company Limited
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