Descrizione

A study by StrategyHelix indicates that the global wireless connectivity market is expected to increase by US$ 76.6 miliardi da 2022 A 2028, ottenendo un CAGR di 12.7% durante il periodo di previsione.

Il rapporto fornisce dati aggiornati sulle dimensioni del mercato per il periodo 2018-2021 e previsione a 2028 covering key market aspects like sales value for wireless connectivity. The global wireless connectivity market is segmented on the basis of technology, network type, end user, e regione. Based on technology, the global wireless connectivity market is categorized into Bluetooth, cellular M2M, LoRa, NFC, Wi-Fi, Zigbee, altri. The Bluetooth segment held the largest share of the global wireless connectivity market in 2021 e si prevede che manterrà la sua quota durante il periodo di previsione. On the basis of network type, the global wireless connectivity market has been segmented into wireless wide area network (WWAN), wireless personal area network (WPAN), wireless local area network (WLAN). Globally, the WPAN segment made up the largest share of the wireless connectivity market. By end user, the global wireless connectivity market has been segmented into automotive and transportation, building automation, consumer electronics and wearables, energy and utilities, healthcare, industrial, IT and telecom, altri. The consumer electronics and wearables segment was the largest contributor to the global wireless connectivity market in 2021. In termini di geografia, the global wireless connectivity market has been segmented into Asia Pacific, Europa, Nord America, Rest of the World (RoW). Asia Pacific is estimated to account for the largest share of the global wireless connectivity market.

The global wireless connectivity market is highly competitive. As of 2021, the major players in the global wireless connectivity market were Broadcom Inc., Infineon Technologies AG, Intel Corporation, MediaTek Inc., Murata Manufacturing Co. Ltd., NXP Semiconductors N.V., Panasonic Corporation, Qualcomm Inc., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments Incorporated (TI). Competitive landscape gives a description of the competitive nature of the global wireless connectivity market and a description of the leading companies. Vengono individuati i principali accordi finanziari che hanno plasmato il mercato negli ultimi anni.

Il rapporto è una risorsa inestimabile per le aziende e le organizzazioni attive in questo settore. It provides a cohesive picture of the wireless connectivity market to help drive informed decision making for industry executives, decisori politici, accademico, e analisti.

Ambito del rapporto

Tecnologia: Bluetooth, cellular M2M, LoRa, NFC, Wi-Fi, Zigbee, altri
Network type: wireless wide area network (WWAN), wireless personal area network (WPAN), wireless local area network (WLAN)
Utente finale: automotive and transportation, building automation, consumer electronics and wearables, energy and utilities, healthcare, industrial, IT and telecom, altri
Regione: Asia Pacifico, Europa, Nord America, Rest of the World (RoW)
Anni considerati: la presente relazione copre il periodo 2018 A 2028
Azienda menzionata: Broadcom Inc., Infineon Technologies AG, Intel Corporation, MediaTek Inc., Murata Manufacturing Co. Ltd., NXP Semiconductors N.V., Panasonic Corporation, Qualcomm Inc., Renesas Electronics Corporation, STMicroelectronics N.V., Texas Instruments Incorporated (TI)

Principali vantaggi per gli stakeholder

– Get a comprehensive picture of the global wireless connectivity market
– Individuare i settori in crescita e le tendenze per gli investimenti

Sommario

Parte 1. introduzione
– Ambito dello studio
– Periodo di studio
– Ambito geografico
– Metodologia di ricerca
Parte 2. Wireless connectivity market overview
Parte 3. Market breakdown by technology
– Bluetooth
– Cellular M2M
– LoRa
– NFC
– Wi-Fi
– Zigbee
– Altri
Parte 4. Market breakdown by network type
– Wireless wide area network (WWAN)
– Wireless personal area network (WPAN)
– Wireless local area network (WLAN)
Parte 5. Market breakdown by end user
– Automotive and transportation
– Building automation
– Consumer electronics and wearables
– Energy and utilities
– Assistenza sanitaria
– Industrial
– IT and telecom
– Altri
Parte 6. Market breakdown by region
– Asia Pacifico
– Europa
– Nord America
– Rest of the World (RoW)
Parte 7. Aziende chiave
– Broadcom Inc.
– Infineon Technologies AG
– Intel Corporation
– MediaTek Inc.
– Murata Manufacturing Co., Ltd.
– NXP Semiconductors N.V.
– Panasonic Corporation
– Qualcomm Inc.
– Renesas Electronics Corporation
– STMicroelectronics N.V.
– Texas Instruments Incorporated (TI)
Informazioni su StrategyHelix
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