Global COTS Components for Satellites Market 2022
- Rapporto sul mercato
- ID: HA24992G
- Tempi di consegna: 1 Giorno lavorativo
- Etichetta: COTS Components for Satellites
Descrizione
The global cots components for satellites market is poised to grow by US$ 302.2 milioni durante 2022-2028, procedendo a un CAGR di 1.4% durante il periodo di previsione, secondo la società di dati e analisi StrategyHelix.
Il rapporto fornisce dati aggiornati sulle dimensioni del mercato per il periodo 2018-2021 e previsione a 2028 covering key market aspects like sales value for cots components for satellites. The global cots components for satellites market is segmented on the basis of subsystem, mass class, e regione. By subsystem, the global cots components for satellites market has been segmented into attitude determination and control subsystem, command and data handling system, communication subsystem, electrical and power subsystem, payload, propulsion control subsystem, thermal control subsystem, altri. In 2021, the attitude determination and control subsystem segment made up the largest share of revenue generated by the cots components for satellites market. Based upon mass class, the global cots components for satellites market is categorized into 0-500kg, 501-1,000kg, 1,001kg and above. Geograficamente, the global cots components for satellites market is segmented into Asia Pacific, Europa, Nord America, Rest of the World (RoW).
The global cots components for satellites market is highly competitive. The leading players in the cots components for satellites market include Amplified Design LLC, Analog Devices Inc., BAE Systems plc, Cobham Limited, Curtiss-Wright Corporation, Data Device Corporation (DDC), Exxelia SAS, GSI Technology Inc., Honeywell International Inc., Infineon Technologies AG, Microchip Technology Inc., Micropac Industries Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Xilinx Inc. Competitive landscape gives a description of the competitive nature of the global cots components for satellites market and a description of the leading companies. Vengono individuati i principali accordi finanziari che hanno plasmato il mercato negli ultimi anni.
Il rapporto è una risorsa inestimabile per le aziende e le organizzazioni attive in questo settore. It provides a cohesive picture of the cots components for satellites market to help drive informed decision making for industry executives, decisori politici, accademico, e analisti.
Ambito del rapporto
Subsystem: attitude determination and control subsystem, command and data handling system, communication subsystem, electrical and power subsystem, payload, propulsion control subsystem, thermal control subsystem, altri
Mass class: 0-500kg, 501-1,000kg, 1,001kg and above
Regione: Asia Pacifico, Europa, Nord America, Rest of the World (RoW)
Anni considerati: la presente relazione copre il periodo 2018 A 2028
Azienda menzionata: Amplified Design LLC, Analog Devices Inc., BAE Systems plc, Cobham Limited, Curtiss-Wright Corporation, Data Device Corporation (DDC), Exxelia SAS, GSI Technology Inc., Honeywell International Inc., Infineon Technologies AG, Microchip Technology Inc., Micropac Industries Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Xilinx Inc.
Principali vantaggi per gli stakeholder
– Get a comprehensive picture of the global cots components for satellites market
– Individuare i settori in crescita e le tendenze per gli investimenti
Sommario
Parte 1. introduzione
– Ambito dello studio
– Periodo di studio
– Ambito geografico
– Metodologia di ricerca
Parte 2. Cots components for satellites market overview
Parte 3. Market breakdown by subsystem
– Attitude determination and control subsystem
– Command and data handling system
– Communication subsystem
– Electrical and power subsystem
– Payload
– Propulsion control subsystem
– Thermal control subsystem
– Altri
Parte 4. Market breakdown by mass class
– 0-500kg
– 501-1,000kg
– 1,001kg and above
Parte 5. Market breakdown by region
– Asia Pacifico
– Europa
– Nord America
– Rest of the World (RoW)
Parte 6. Aziende chiave
– Amplified Design, LLC
– Analog Devices, Inc.
– BAE Systems plc
– Cobham Limited
– Curtiss-Wright Corporation
– Data Device Corporation (DDC)
– Exxelia SAS
– GSI Technology, Inc.
– Honeywell International Inc.
– Infineon Technologies AG
– Microchip Technology, Inc.
– Micropac Industries, Inc.
– STMicroelectronics N.V.
– Texas Instruments Incorporated
– Xilinx, Inc.
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