विवरण

A study by StrategyHelix indicates that the global fan out packaging market is expected to increase by US$ 2.7 billion from 2022 को 2028, का सीएजीआर जुटाना 17.2% पूर्वानुमान अवधि के दौरान.

रिपोर्ट अवधि के लिए नवीनतम बाज़ार आकार डेटा प्रदान करती है 2018-2021 और पूर्वानुमान करें 2028 covering key market aspects like sales value for fan out packaging. The global fan out packaging market is segmented on the basis of type, carrier type, business model, and region. प्रकार के आधार पर, the global fan out packaging market is categorized into core-fan out, high-density fan out, ultra high-density fan out. Globally, the high-density fan out segment made up the largest share of the fan out packaging market. On the basis of carrier type, the global fan out packaging market has been segmented into 200 mm, 300 mm, Panel. The 300 mm segment captured the largest share of the market in 2021. By business model, the global fan out packaging market has been segmented into foundry, integrated device manufacturer (IDM), outsourced semiconductor assembly and test (OSAT). According to the research, the foundry segment had the largest share in the global fan out packaging market. In terms of geography, the global fan out packaging market has been segmented into China, Europe, जापान, South Korea, ताइवान, संयुक्त राज्य अमेरिका. Taiwan held the largest revenue share in 2021.

The global fan out packaging market is highly competitive. The competitive landscape of the industry has also been examined along with the profiles of the key players Amkor Technology Inc., ASE Inc., JCET Group, Nepes Corporation, Powertech Technology Inc., Samsung Electronics Co. लिमिटेड, Taiwan Semiconductor Manufacturing Company Limited. Competitive landscape gives a description of the competitive nature of the global fan out packaging market and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

यह रिपोर्ट इस उद्योग में सक्रिय कंपनियों और संगठनों के लिए एक अमूल्य संसाधन है. It provides a cohesive picture of the fan out packaging market to help drive informed decision making for industry executives, नीति निर्माताओं, अकादमिक, और विश्लेषक.

रिपोर्ट का दायरा

प्रकार: core-fan out, high-density fan out, ultra high-density fan out
Carrier type: 200 mm, 300 mm, Panel
Business model: foundry, integrated device manufacturer (IDM), outsourced semiconductor assembly and test (OSAT)
Region: चीन, Europe, जापान, South Korea, ताइवान, संयुक्त राज्य अमेरिका
Years considered: यह रिपोर्ट उस अवधि को कवर करती है 2018 को 2028
Company mentioned: Amkor Technology Inc., ASE Inc., JCET Group, Nepes Corporation, Powertech Technology Inc., Samsung Electronics Co. लिमिटेड, Taiwan Semiconductor Manufacturing Company Limited

हितधारकों के लिए मुख्य लाभ

– Get a comprehensive picture of the global fan out packaging market
– विकास क्षेत्रों और निवेश के रुझानों को इंगित करें

विषयसूची

Part 1. Introduction
– Scope of the study
– Study period
– Geographical scope
– Research methodology
Part 2. Fan out packaging market overview
Part 3. Market breakdown by type
– Core-fan out
– High-density fan out
– Ultra high-density fan out
Part 4. Market breakdown by carrier type
– 200 mm
– 300 mm
– Panel
Part 5. Market breakdown by business model
– Foundry
– Integrated device manufacturer (IDM)
– Outsourced semiconductor assembly and test (OSAT)
Part 6. Market breakdown by region
– चीन
– Europe
– जापान
– South Korea
– ताइवान
– संयुक्त राज्य अमेरिका
Part 7. Key companies
– Amkor Technology Inc.
– ASE, इंक.
– JCET Group
– Nepes Corporation
– Powertech Technology Inc.
– Samsung Electronics Co., लिमिटेड.
– Taiwan Semiconductor Manufacturing Company Limited
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