Beskrywing

Volgens StrategyHelix, the global IO link system market is expected to increase by US$ 19.5 miljard tydens 2022-2028, brei uit teen 'n CAGR van 23.4% gedurende die voorspellingsperiode.

Die verslag verskaf up-to-date markgrootte data vir tydperk 2018-2021 en voorspel tot 2028 covering key market aspects like sales value for IO link system. The global IO link system market is segmented on the basis of component, aansoek, industry, en streek. Based on component, the global IO link system market is categorized into IO-Link devices, IO-Link masters. The IO-Link devices segment captured the largest share of the market in 2021. On the basis of application, the global IO link system market has been segmented into handling and assembly automation, intralogistics, machine tools, verpakking. The handling and assembly automation segment held the largest share of the global IO link system market in 2021 and is anticipated to hold its share during the forecast period. By industry, the global IO link system market has been segmented into discrete manufacturing, process manufacturing. In 2021, the discrete manufacturing segment made up the largest share of revenue generated by the IO link system market. Geografies, the global IO link system market is segmented into Asia Pacific, Europa, Noord-Amerika, Rest of the World (RoW). Onder hierdie, Europe was accounted for the highest revenue generator in 2021.

The global IO link system market is highly competitive. The prominent players operating in the global IO link system market include Balluff GmbH, Banner Engineering Corp., Datalogic S.p.A., Festo Corporation, Hans Turck GmbH & Co. KG, ifm electronic GmbH, Omron Corp., Pepperl+Fuchs SE, Rockwell Automation Inc., Sick AG, Siemens AG. Competitive landscape gives a description of the competitive nature of the global IO link system market and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

Die verslag is 'n waardevolle hulpbron vir maatskappye en organisasies wat in hierdie bedryf aktief is. It provides a cohesive picture of the IO link system market to help drive informed decision making for industry executives, beleidmakers, akademies, en ontleders.

Verslag Omvang

Component: IO-Link devices, IO-Link masters
Toepassing: handling and assembly automation, intralogistics, machine tools, verpakking
Industry: discrete manufacturing, process manufacturing
Streek: Asiatiese Stille-Oseaan, Europa, Noord-Amerika, Rest of the World (RoW)
Jare oorweeg: hierdie verslag dek die tydperk 2018 aan 2028
Company mentioned: Balluff GmbH, Banner Engineering Corp., Datalogic S.p.A., Festo Corporation, Hans Turck GmbH & Co. KG, ifm electronic GmbH, Omron Corp., Pepperl+Fuchs SE, Rockwell Automation Inc., Sick AG, Siemens AG

Sleutelvoordele vir belanghebbendes

– Get a comprehensive picture of the global IO link system market
– Bepaal groeisektore en -neigings vir belegging

INHOUDSOPGAWE

Deel 1. Inleiding
– Omvang van die studie
– Studietydperk
– Geografiese omvang
– Navorsingsmetodologie
Deel 2. IO link system market overview
Deel 3. Market breakdown by component
– IO-Link devices
– IO-Link masters
Deel 4. Markverdeling volgens toepassing
– Handling and assembly automation
– Intralogistics
– Machine tools
– Verpakking
Deel 5. Market breakdown by industry
– Discrete manufacturing
– Process manufacturing
Deel 6. Market breakdown by region
– Asiatiese Stille-Oseaan
– Europa
– Noord-Amerika
– Rest of the World (RoW)
Deel 7. Sleutel maatskappye
– Balluff GmbH
– Banner Engineering Corp.
– Datalogic S.p.A.
– Festo Corporation
– Hans Turck GmbH & Co. KG
– ifm electronic GmbH
– Omron Corp.
– Pepperl+Fuchs SE
– Rockwell Automation, Inc.
– Sick AG
– Siemens AG
Oor StrategyHelix
Vrywaring