Beskrywing

The global 2.5d and 3d semiconductor packaging market is set to increase by US$ 8.5 billion from 2022 aan 2028, representing a compound annual growth rate (CAGR) van 13.6% gedurende die voorspellingsperiode.

Die verslag verskaf up-to-date markgrootte data vir tydperk 2018-2021 en voorspel tot 2028 covering key market aspects like sales value for 2.5d and 3d semiconductor packaging. The global 2.5d and 3d semiconductor packaging market is segmented on the basis of technology, end user, en streek. On the basis of technology, the global 2.5d and 3d semiconductor packaging market has been segmented into 2.5D, 3D. Onder hierdie, the 3D segment was accounted for the highest revenue generator in 2021. By end user, the global 2.5d and 3d semiconductor packaging market has been segmented into automotive, consumer electronics, medical devices, telecommunications, ander. In terms of geography, the global 2.5d and 3d semiconductor packaging market has been segmented into China, Japan, South Korea, Taiwan, Verenigde State, Rest of the World (RoW). Taiwan held the largest share of the global 2.5d and 3d semiconductor packaging market in 2021 and is anticipated to hold its share during the forecast period.

The global 2.5d and 3d semiconductor packaging market is highly competitive. Asof 2021, the major players in the global 2.5d and 3d semiconductor packaging market were Advanced Semiconductor Engineering Inc., Amkor Technology Inc., GlobalFoundries Inc., Intel Corporation, JCET Group Co. Bpk., Powertech Technology Inc., Samsung Electronics Co. Bpk., Siliconware Precision Industries Co. Bpk. (SPIL), Taiwan Semiconductor Manufacturing Company Limited (TSMC), Tezzaron Semiconductor Corp. Competitive landscape gives a description of the competitive nature of the global 2.5d and 3d semiconductor packaging market and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.

Die verslag is 'n waardevolle hulpbron vir maatskappye en organisasies wat in hierdie bedryf aktief is. It provides a cohesive picture of the 2.5d and 3d semiconductor packaging market to help drive informed decision making for industry executives, beleidmakers, akademies, en ontleders.

Verslag Omvang

Tegnologie: 2.5D, 3D
End user: automotive, consumer electronics, medical devices, telecommunications, ander
Streek: Sjina, Japan, South Korea, Taiwan, Verenigde State, Rest of the World (RoW)
Jare oorweeg: hierdie verslag dek die tydperk 2018 aan 2028
Company mentioned: Advanced Semiconductor Engineering Inc., Amkor Technology Inc., GlobalFoundries Inc., Intel Corporation, JCET Group Co. Bpk., Powertech Technology Inc., Samsung Electronics Co. Bpk., Siliconware Precision Industries Co. Bpk. (SPIL), Taiwan Semiconductor Manufacturing Company Limited (TSMC), Tezzaron Semiconductor Corp.

Sleutelvoordele vir belanghebbendes

– Get a comprehensive picture of the global 2.5d and 3d semiconductor packaging market
– Bepaal groeisektore en -neigings vir belegging

INHOUDSOPGAWE

Deel 1. Inleiding
– Omvang van die studie
– Studietydperk
– Geografiese omvang
– Navorsingsmetodologie
Deel 2. 2.5d and 3d semiconductor packaging market overview
Deel 3. Market breakdown by technology
– 2.5D
– 3D
Deel 4. Market breakdown by end user
– Automotive
– Consumer electronics
– Medical devices
– Telecommunications
– Ander
Deel 5. Market breakdown by region
– Sjina
– Japan
– South Korea
– Taiwan
– Verenigde State
– Rest of the World (RoW)
Deel 6. Sleutel maatskappye
– Advanced Semiconductor Engineering, Inc.
– Amkor Technology, Inc.
– GlobalFoundries Inc.
– Intel Corporation
– JCET Group Co., Bpk.
– Powertech Technology Inc.
– Samsung Electronics Co., Bpk.
– Siliconware Precision Industries Co., Bpk. (SPIL)
– Taiwan Semiconductor Manufacturing Company Limited (TSMC)
– Tezzaron Semiconductor Corp.
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